Model Number: 290601290 Brand Name: DAFENG Key Specifications/Special Features: Specializing PCB assemblyAccept ODM, OEM serviceArtificial intelligenceLeakage protectionLead free CAPABILITYSTANDARD ADVANCED MinimumLayer Count 1 1 Maximum Layer Count 12 40 Material FR-4 (Tg-135C, 145C, 170C),Halogen- free
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003
Polyimide
Teflon
Black FR-4
Arlon AR-350
CEM-3
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
PTFE
Metal Core Materials
Aluminum Core Board Thickness 0.020"-0.125" 0.005"-0.250" Maximum Board Size 16"x 22"
12"x 21"
22"x 28" 10"x 16"
16"x 22"
12"x 21"
22"x 28" Copper Thickness 0.5 oz–3 oz 0.25 oz–12 oz Minimum Trace Width / Spacing 0.004"/0.004" 0.003"/0.003" Solder Mask Color Green, Blue, Black, Red, Yellow, White, Clear, andcustomized Silkscreen Color White, Black, Yellow, Green, Red, Blue andcustomized Minimum Hole Size 0.008" 0.004" Finished Hole Size Tolerance +/-0.003" +/-0.002" PCB Surface Finish HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,
HASL + GoldFinger,Immersion Tin(ISn), ImmersionSilver(IAg), Carbon
Ink, Hard Gold(Flash Gold),Soft Gold IPC Class Class 2 Class 3 Controlled Impedance Tolerance +/-10 % +/-5 % Blind Vias Yes Yes Buried Vias Yes Yes Aspect Ratio 8/1 15/1 Minimum Core Thickness 0.004" 0.002" Carbon Ink Yes Yes Peelable Mask Yes Yes Solder Sample Yes Yes First Article Yes Yes ISO 9001:2008 Yes Yes ISO/TS16949: 2009 Yes Yes UL 94v0 Yes Yes